| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming an electroconductive coating capable of substituting for an electroless plating method, which can form an electroconductive film having high adhesiveness even to the flat surface of a resin. SOLUTION: The method for forming the electroconductive coating onto the resin substrate is characterized by treating the resin substrate with the method including the steps of (1) introducing an acidic group into the resin substrate, (2) contacting the resin substrate treated in the above step (1) with a solution including metal ions, (3) converting the metal ions adsorbed or bonded to the resin substrate in the above step (2) into metal compounds, and (4) forming the electroconductive film on the resin substrate by reducing the resin substrate treated in the above step (3).
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