| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating method for a molded article of a polyimide resin suitable for a flexible substrate for a printed wiring, which can be industrialized without a precisely-controlled embrocation coating device and a curing device, aside from a plating facility. SOLUTION: This method for electroless plating the surface layer to be plated of the molded article of the polyimide resin comprises 4 steps of (1) hydrolyzing an imide bond existing in the surface layer to be plated, with an alkali-metal hydroxide aqueous solution, (2) removing the hydrolysis products of low molecular weight remaining in the surface layer, (3) activating the surface layer by applying a catalyst on it, and (4) subjecting it to electroless metal plating.
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