| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that when a plurality of thin plates such as wafers are cut simultaneously from a base material such as a crystalline ingot, it is difficult to prevent the thin plates from falling. SOLUTION: In the first process, when the wafers are obtained by cutting parts to be cut of the crystalline ingot 3 arranged in an etching gas by a photochemical reaction by irradiating the parts to be cut with light led from a light source through optical waveguide bodies 51 in the shape of a sheet, a rod, or a fiber, the optical waveguide bodies are arranged in the axial direction of the ingot, and the light is led simultaneously to the parts to be cut of the ingot through the optical waveguide bodies until a state before all the parts to be cut are cut, and in the second process, the light is led only to one part to be cut on the tip side of the ingot through the optical waveguide body, and the parts to be cut in a state before all the parts to be cut are cut are cut in turn.</p> |
