DIE-ATTACHING PASTE AND SEMICONDUCTOR DEVICE

摘要

The present invention provides a die-attaching paste superior in solder cracking resistance, used for bonding of semiconductor chips. The present invention lies in a die-attaching paste comprising as essential components:(A) a hydrocarbon having a number-average molecular weight of 500 to 5,000 and at least one double bond in the molecule, or its derivative,(B) a reactive diluent,(C) a radical polymerization catalyst, and(D) a filler.