| 摘要 |
PURPOSE: A surface acoustic wave element and a manufacturing method thereof are provided to reduce ohmic loss by reducing electrode electrical resistance and of operating at a high-frequency range. CONSTITUTION: A surface acoustic wave element is stored in a package and connected with a solder bump formed at the package. The surface acoustic wave element is provided with a piezoelectric substrate(42), at least one ID(Inter Digital) electrode(43) formed at the upper portion of the piezoelectric substrate, a pair of bus bar electrodes connected to the ID electrode, a lead electrode connected to the bus bar electrode, a pair of electrode pads(50,51) connected to the lead electrode and electrically connected to the package, the first metal layer formed at the upper portion of the electrode pad for increasing bonding intensity with the solder bump, and the second metal layer formed at the upper portion of at least one out of the bus bar electrode and the lead electrode. |
