| 摘要 |
PURPOSE: A bonding system is provided to minimize a possibility that an operator modifies a parameter incorrectly by comparing a master set of parameters with modified parameters in real time. CONSTITUTION: The bonding system(1) bonds wires between the first electrical contact surface on a semiconductor chip and the second electrical contact surface on the substrate. The bonding system has the first memory device(3) having a master bond program stored thereon and the second memory device(4) having an operating bond program stored thereon. The operating bond program is generated by transferring a copy of the master bond program from the first memory device is adapted to permit a parameter of the operating bond parameters to be modified. A processing device(2) is coupled to the first and second memory devices. An input device(5) is coupled to the processing device and an output device is also coupled to the processing device. The processing device, on receiving an input signal from the input device to modify a bond parameter, compares the modified parameter with the corresponding parameter in the master bond program and stores the modified parameter in the operating bond program if the modified parameter is within a tolerance of the corresponding parameter in the master bond program. The processing device outputs a signal to the output device if the modified perimeter is not within the tolerance. |
