| 摘要 |
<p>PURPOSE: A compressive lead pin for PGA(Pin Grid Array) package is provided to prevent separation of a lead pin from a printed circuit board in a shifting process of the printed circuit board by forming a plurality of compressive grooves on a circular lead pin inserted into a pin hole of the printed circuit board. CONSTITUTION: A lead pin is inserted and soldered into a pin hole of a printed circuit board in a PGA package. A plurality of compressive grooves(31) are formed in a predetermined interval at a side portion of one front end portion of a circular lead pin(30). The compressive grooves(31) are used for preventing separation of the circular lead pin(30) in a process for transferring the printed circuit board by applying compressive force when the lead pin is inserted into the pin hole of the printed circuit board.</p> |
