| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition excellent in heat resistance, mechanical characteristics and adhesive properties and having a capability of forming films improved in flame retardance. SOLUTION: The curable resin composition comprises a heat-curable resin having at least one dihydrobenzoxazine ring and a polyimide resin or a polyimide precursor in a weight ratio of 5-95:95-5, wherein the polyimide resin is a polyimide resin prepared from an aromatic tetracarboxylic acid dianhydride and biphenyldiamine or diaminosiloxane, and the heat-curable resin having a dihydrobenzoxazine ring is a resin represented by formura (3).
|
