| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for depositing a catalyst for electroless plating onto the surface of the resin substrate, which can reduce a consumption amount of palladium and shorten the treatment process without decreasing catalytic activity, in the process of depositing the catalyst. SOLUTION: The method is characterized by etching the surface of the resin substrate with an etching solution including a Pd compound, and then contacting it with an aqueous solution including a reducing agent.
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