| 摘要 |
In a shaped solder body with a flux coating comprising 75-95 wt.% flux and 5-25 wt.% binder, the binder consists of 35-90 wt.% potassium silicate with a K2O : SiO2 molar ratio of 1 : 1.25-4.5, 1.5-30 wt.% phosphoric acid, 0-15 wt.% boric acid and 0-30 wt.% finely divided silica. Also claimed is a process for producing the above flux-coated solder body which involves curing at 20-100 degrees C an applied flux-binder mixture formed by adding a mixture of 5-30 wt.% potassium waterglass with a K2O : SiO2 molar ratio of 1 : 1.25-4.5, 0.5-10 wt.% concentrated phosphoric acid, 0-5 wt.% boric acid, 0-10 wt.% finely divided silica and balance water to the flux and stirring with water addition to achieve a lumpy consistency. |
