发明名称 |
UNLEADED SOLDER ALLOY AND ELECTRONIC COMPONENTS USING IT |
摘要 |
<p>Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented. Solder attachment of connecting portions of insulation coated conductors having copper as a base material is carried out by melting lead-free solder alloy containing from 5.3 to 7.0 wt% copper (Cu), from 0.1 to less than 0.5 wt% nickel (Ni), with a remainder being tin (Sn), at a temperature ranging from 400 DEG C to 480 DEG C. <IMAGE></p> |
申请公布号 |
EP1275467(A1) |
申请公布日期 |
2003.01.15 |
申请号 |
EP20010906341 |
申请日期 |
2001.02.27 |
申请人 |
SUMIDA CORPORATION;SUMIDA TECHNOLOGIES INCORPORATED;NIHON GENMA MFG. LTD. |
发明人 |
IZUMIDA, KOICHI;TAKANO, YUKI;ABE, HITOSHI;MORIBAYASHI, TOSHIYUKI;HAGIO, KOICHI;TAKENAKA, JUNICHI |
分类号 |
B23K35/14;B23K35/26;H01F27/29;H01F41/10;(IPC1-7):B23K35/26;H01F27/28 |
主分类号 |
B23K35/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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