Charge beam exposure apparatus, charge beam exposure method, and charge beam exposure mask

摘要

There are provided a second aperture having a beam adjustment opening group and a pattern exposure opening group, a stage for mounting a wafer to which a pattern should be transferred, and a control computer for controlling an electron beam to be irradiated onto the wafer. The control computer has a drawing parameter table which stores an optimum beam adjustment parameter for an electron beam using a pattern density as a parameter. A pattern is transferred by selecting an optimum beam adjustment parameter corresponding to the pattern density from the drawing parameter table for each pattern.