| 摘要 |
A method and structure for heat transport, cooling, sensing and power generation is described. A photonic bandgap structure ( 3 ) is employed to enhance emissive heat transport from heat sources such as integrated circuits ( 2 ) to heat spreaders ( 4 ). The photonic bandgap structure ( 3 ) is also employed to convert heat to electric power by enhanced emission absorption and to cool and sense radiation, such as infra-red radiation. These concepts may be applied to both heat loss and heat absorption, and may be applied to heat transport and absorption enhancement in a single device. |
