APPARATUS FOR FABRICATING SEMICONDUCTOR

摘要

PURPOSE: An apparatus for fabricating a semiconductor is provided to avoid a wafer defect caused by delayed detection of a defective thickness of applied photoresist by using a thickness detecting unit so that the thickness of the photoresist is detected as soon as the photoresist is applied. CONSTITUTION: A constant thickness of the photoresist is applied on a wafer(40) in a spinner process. The applied photoresist is patterned in a stepper process. The wafer is patterned through the spinner process and the stepper process. The thickness detecting unit for checking the thickness of the photoresist spin-coated in a spin part is installed in an interface between the spin part(10) and a bake part(30) in the spinner process.