发明名称 Die paddle clamping for wire bond enhancement
摘要 A leadframe configuration for a semiconductor device has a die attach paddle with paddle support bars. In addition, clamp tabs extend outwardly from lesser supported locations of the paddle to underlie a conventional lead clamp. The clamp tabs are formed as an integral part of the paddle. Normal clamping during die attach and wire bonding operations prevents paddle movement and enhances integrity of the die bond and wire bonds.
申请公布号 US6507094(B2) 申请公布日期 2003.01.14
申请号 US20010903318 申请日期 2001.07.11
申请人 MICRON TECHNOLOGY, INC. 发明人 CORISIS DAVID J.
分类号 H01L21/607;H01L23/495;(IPC1-7):H01L23/495 主分类号 H01L21/607
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