发明名称 |
Semiconductor testing equipment with probe formed on a cantilever of a substrate |
摘要 |
The conventional semiconductor element testing equipment is arranged to position each probe accurately and need a burdensome operation for fixing, and includes only a limited number of electrode pads and chips to be tested at a batch. An equipment for testing a semiconductor element is arranged to keep each of electrode pads formed on a semiconductor element to be tested in direct contact with each of probes formed on a first substrate composed of silicon, one of electric connecting substrates disposed in the equipment. On the first substrate, each probe is formed on a cantilever and a wire is routed from a tip of each probe along a tip of the cantilever to the electrode pad formed on an opposite surface to the probe forming surface through an insulating layer.
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申请公布号 |
US6507204(B1) |
申请公布日期 |
2003.01.14 |
申请号 |
US20000522477 |
申请日期 |
2000.03.09 |
申请人 |
HITACHI, LTD. |
发明人 |
KANAMARU MASATOSHI;ENDO YOSHISHIGE;HOSOGANE ATSUSHI;NAGATA TATSUYA;KOHNO RYUJI;AOKI HIDEYUKI;ARIGA AKIHIKO |
分类号 |
G01R1/073;G01R1/067;G01R3/00;G01R31/02;H01L21/66;(IPC1-7):G01R31/02 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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