发明名称 Electronic interface structures and methods of fabrication
摘要 One type of electronic interface structure includes a base; at least one elastomeric island supported by the base; and patterned metallization overlying the at least one elastomeric island and including at least one floating pad at least partially overlying the at least one elastomeric island. Another type of electronic interface structure includes a base; a first dielectric layer overlying the base and having at least one first dielectric layer opening therein; a second dielectric layer overlying the first dielectric layer; and patterned metallization overlying the second dielectric layer and including at least one floating pad at least partially overlying the at least one opening.
申请公布号 US6507113(B1) 申请公布日期 2003.01.14
申请号 US19990443410 申请日期 1999.11.19
申请人 GENERAL ELECTRIC COMPANY 发明人 FILLION RAYMOND ALBERT;WOJNAROWSKI ROBERT JOHN;KOLC RONALD FRANK
分类号 H01L23/485;H01L23/498;H05K1/02;H05K1/11;H05K3/32;H05K3/40;H05K3/46;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/485
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