| 摘要 |
A manufacturing apparatus (13) of a semiconductor device includes an introducing section (13-1), a process section, and a withdrawing section (13-2). The introducing section (13-1) introduces a transfer box therein. The process section takes in the semiconductor substrate put in the introducing section and applies a prescribed processing to the semiconductor substrate. Further, the withdrawing section (13-2) is arranged on a surface differing from the surface on which the introducing section (13-1) is arranged and discharges the transfer box holding the semiconductor substrate withdrawn from the process section of the semiconductor substrate. <IMAGE>
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