AIR BLOW SYSTEM FOR ELIMINATING PARTICLES ON SEMICONDUCTOR PACKAGE

摘要

PURPOSE: An air blow system for eliminating particles on a semiconductor package is provided to increase yield in a test process by effectively eliminating the particles generated in a cutting process for isolating each unit of a ball grid array(BGA) package of a strip state. CONSTITUTION: A closed space is supplied by an outer case. A tray settle unit(2) is installed in the outer case. Guide rails are installed at both sides of a tray. An air nozzle bar(4) sprays air on the upper surface of the package settled in the tray, moving back and forth while being guided by the guide rail. An ionizing air nozzle(5) sprays air in approximately parallel with the tray, generating negative ions and positive ions to electrically neutralize a charged object inside the outer case. The air sprayed through the ionizing air nozzle and the air nozzle bar is exhausted to the outside by an exhaust port(6a,6b).