Apparatus having an electronic component located on a surface of a package member with a space therebetween

摘要

An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.