| 摘要 |
A back-to-back semiconductor device module including two semiconductor devices, the backs of each being secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the device module. The device module may be secured to a carrier substrate in a substantially perpendicular orientation relative to the former. Solder reflow or a module-securing device can secure the device module to the carrier substrate. An embodiment of a module-securing device comprises an alignment device having one or more receptacles formed therein and intermediate conductive elements that are disposed within the receptacles to establish an electrical connection between the semiconductor devices and the carrier substrate. Another module-securing device comprises a clip-on lead, where one end resiliently biases against a lead of at least one of the semiconductor devices, while the other end connects electrically to a carrier substrate terminal. |
