| 摘要 |
In a method for controlling airflow on a backside of a semiconductor wafer during spin processing, a wafer backing plate is first disposed below a semiconductor wafer. Air is then supplied to the volume defined by the wafer backing plate and the semiconductor wafer. The air may be supplied to the volume through a hollow core spindle, a rotary union, or apertures in the wafer backing plate. The separation distance between the wafer and the wafer backing plate and the flow rate of air supplied to the volume may be controlled to avoid any substantial recirculation of contaminated air into the volume. In addition to serving as one of the boundaries that define the volume, the wafer backing plate reduces particle recontamination on the backside of the wafer by preventing particles from contacting the backside of the wafer during spin processing.
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