发明名称 COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT
摘要 <p>PURPOSE: Provided is a cover tape which has a peeling strength not too high and not too low and high transparency, is small in difference between the maximum value and the minimum value, and can be produced at a low cost. CONSTITUTION: The cover tape for packaging electronic components can be heat-sealed to a plastic-made carrier tape having pockets capable of storing electronic components, formed regularly therein. The cover tape(1) is characterized by comprising (A) a biaxially oriented film layer(2) made of polyester, polypropylene or nylon, and (B) a thermoplastic resin layer(3) composed of 100 parts by weight of an ethylene copolymer and 10 to 100 parts by weight of a polystyrene, laminated to one side of the layer (A).</p>
申请公布号 KR20030004075(A) 申请公布日期 2003.01.14
申请号 KR20020036127 申请日期 2002.06.26
申请人 SUMITOMO BAKELITE CO., LTD. 发明人 HIRAMATU MASAYUKI;NAKANISHI HISAO
分类号 C09J7/04;B32B27/32;B32B27/34;B32B27/36;C09J7/02;(IPC1-7):C09J7/04 主分类号 C09J7/04
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