发明名称 POLYETHYLENE MOULDING COMPOUND WITH AN IMPROVED ESCR-STIFFNESS RELATION AND AN IMPROVED SWELLING RATE, A METHOD FOR THE PRODUCTION THEREOF AND THE USE THEREOF
摘要 The invention relates to a polyethylene moulding compound having a multimodal molecular weight distribution which has an overall density of >=0.940 g/cm<3 >and an MFI190/5 in the range from 0.01 to 10 dg/min. The moulding compound according to the invention comprises an amount of from 30 to 60% by weight of low-molecular-weight ethylene homopolymer A which has a viscosity number VNA in the range from 40 to 150 cm<3>/g, an amount of from 30 to 65% by weight of high-molecular-weight copolymer B comprising ethylene and a further olefin having from 4 to 10 carbon atoms which has a viscosity number VNB in the range from 150 to 800 cm<3>/g, and an amount of from 1 to 30% by weight of ultrahigh-molecular-weight ethylene homopolymer C which has a viscosity number VNC in the range from 900 to 3000 cm<3>/g.The invention also relates to a method for the production of the moulding compound in a three-step process, and to the use thereof for the production of hollow articles.
申请公布号 KR20030004297(A) 申请公布日期 2003.01.14
申请号 KR20027003779 申请日期 2000.09.09
申请人 发明人
分类号 B65D1/00;C08L23/06;B29C49/04;B29D22/00;B29K23/00;B29L22/00;C08F2/00;C08F2/18;C08F4/642;C08F10/00;C08F10/02;C08F110/02;C08J5/00;C08L23/04;C08L23/08;C08L23/16 主分类号 B65D1/00
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