发明名称 High performance cooling device
摘要 A low-cost, fan assisted cooling device is disclosed. The cooling device includes a narrow bottom and broad top shape to optimize a material versus performance ratio. A plurality of vanes surround a central heat mass and an inside surface of the vanes define a chamber that surrounds the heat mass. A portion of each vane is split into a plurality of fins and both the vanes and the fins have a surface area that increase in a radially outward direction from an axis of the heat mass. The heat mass includes a boss that is surrounded by a groove. Both the boss and the grove have arcuate surface profiles. The vanes, the fins, the boss, and the groove efficiently dissipate heat when a fan or the like forces air into the chamber thereby producing air flows in three different directions. In a first direction, the air flows out of the chamber through the vanes. In a second direction, a low pressure region in the chamber induces air from outside the chamber to flow through the fins. In a third direction, the low pressure region induces an airflow over the groove and boss. Openings between the vanes are angled and offset from an orientation of the fans blades to minimize the airflow shock losses thereby reducing fan noise. The vanes and the fins can be homogeneously formed with the heat mass.
申请公布号 US6505680(B1) 申请公布日期 2003.01.14
申请号 US20010916932 申请日期 2001.07.27
申请人 HEWLETT-PACKARD COMPANY 发明人 HEGDE SHANKAR
分类号 H01L23/467;(IPC1-7):F28F7/00;F28F13/12;H05K7/20;F28H3/02 主分类号 H01L23/467
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