| 摘要 |
A microprocessor EMI shield is configured for isolating EMI emissions from the microprocessor, and grounding any electric potential caused by EMI emissions detected by the microprocessor heat sink. The microprocessor EMI shield includes a low-impedance conductive surface sufficient for conducting electric potential induced based on EMI emissions from the microprocessor. The microprocessor EMI shield also includes an array of apertures for accommodating the respective microprocessor pins. The array of apertures includes a first group of apertures for accommodating the microprocessor non-ground pins, each having a spaced diameter for avoiding contact with the corresponding non-ground microprocessor pin, and a second group of apertures for accommodating the microprocessor ground pins. The second group of apertures each have a contact member configured for electrically connecting the corresponding ground pin to the low-impedance conductive surface, establishing a ground potential on the low-impedance conductive surface upon connection of the microprocessor pins with respective socket connectors. The low-impedance conductive surface also has an edge portion configured for engaging the microprocessor heat sink overlying the microprocessor, forming an enclosure for enclosing the microprocessor. The enclosure formed by the conductive heat sink surface and the microprocessor EMI shield provides a grounded shield to isolate EMI emissions from the microprocessor.
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