| 摘要 |
A method of manufacturing a semiconductor device in which a semiconductor element, such as a diode, is attached to a support plate and provided with a plastic encapsulation. The plate is provided with a flange which is provided with an undercut region in order to improve the connection between the plate and the encapsulation. The plate is made from a ductile material. A step is formed in the surface of the plate by pressing using a first die, and by pressing using a second die, the flange provided with the undercut region is formed at, or near, the wall of the step. The flange should be formed at, or very close to, the wall of the step in the plate. |
