| 摘要 |
A resin composition which comprises 100 parts by weight of a synthetic resin and 50 to 1,500 parts by weight of magnesium oxide particles, wherein the magnesium oxide particles satisfy the following requirements (i) to (v):(i) an average secondary particle diameter of 0.1 to 130 mum,(ii) a BET method specific surface area of 0.1 to 5 m2/g,(iii) a total content of an Fe compound and an Mn compound of 0.01 wt % or less in terms of metals,(iv) an Na content of 0.001 wt % or less, and(v) a Cl content of 0.005 wt % or less,and a molded product formed therefrom. Since the resin composition of the present invention has excellent flame retardancy, heat conductivity and water resistance, it is advantageously used as a material for sealing a heat generating electronic member such as a semiconductor.
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