| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency module that can integrate and downsize circuit components from a branching circuit, which branches a plurality of transmission reception system signals with different pass bands to respective transmission reception system signals, to a power amplifier and has an excellent characteristic. SOLUTION: A layered board comprising a plurality of layered dielectric layers 11-18 of the high frequency module is provided with a branching circuit DIP 10 that branches a plurality of transmission/reception system signals to respective transmission/reception system signals, switch circuits SW 10, 20 that switch each transmission/reception signal into a transmission system TX signal and a reception system RX signal, with power amplifiers AMP 10, 20 comprising high frequency amplification semiconductor elements and matching circuits MAT 10, 20 that amplify transmission signals with pass frequencies of each transmission system TX and with couplers COP 10, 20 that monitor outputs. |
