| 摘要 |
PROBLEM TO BE SOLVED: To make equipment compact which inspects electronic components for defective bumps. SOLUTION: A second sensor unit 25 comprises first and second imaging means 30A and 30B for photographing the image of a bump Bu of a component Pa. Each of imaging means 30A, 30B comprises a section 31 for irradiating the bump Bu with illumination light obliquely from below, and a camera 32 (light-receiving section) for receiving specular reflection light L from the component Pa and photographs the image of the component Pa moving relatively thereto. Each of imaging means 30A, 30B further comprises a mirror 33 (light guide means), for guiding the specular reflected light L from the bump Bu vertically downward, and the camera 32 is disposed, while directing the light receiving face right above, in order to receive the specular reflected light L guided by the mirror 33. |
