| 摘要 |
PROBLEM TO BE SOLVED: To provide a dummy chip, for accurately evaluating the packaging accuracy of a system for packaging a chip component on a substrate, or the like. SOLUTION: Since each of dummy chips 31, 41 is a next quadrangular prism, having no irregularities on the surface and the individual shape is stabilized, the effect of the variations in the shape of the dummy chip 31, 41 on the suction of a component in the packaging process is suppressed at trial packaging. That effect on the detection of the center of gravity of the chip component is also suppressed in the evaluation process and packaging accuracy of a packaging system can be evaluated accurately. |
