发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide structures of a plug, a capacitor and a wiring suited for a DRAM hybrid LSI, and a method for manufacturing it. SOLUTION: The structure of the plug is formed of a polysilicon layer and a metal layer thereon. When the plug is applied for connecting a cell transistor with a capacitor in a DRAM hybrid LSI, this metal layer is formed with a common metal material used for plugs of a logic transistor. The capacitor of a memory part is formed in the same height with the first wiring layer of a logic part from a silicon substrate. A laminated structure consisting of a conductive film including titanium and a silica glass thereon is used as a hard mask for etching a noble metal such as platinum.
申请公布号 JP2003007850(A) 申请公布日期 2003.01.10
申请号 JP20010184004 申请日期 2001.06.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 MORI YOSHIHIRO;OGAWA HISASHI;OKUNO YASUTOSHI;KOTANI AKIHIKO
分类号 H01L21/768;H01L21/3205;H01L21/8234;H01L21/8242;H01L23/52;H01L27/088;H01L27/10;H01L27/108 主分类号 H01L21/768
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