发明名称 PIEZOELECTRIC DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To improve characteristics of a piezoelectric device having a piezoelectric element on a substrate by suppressing a deterioration of characteristics of the device itself caused by a fault of a connecting part of the substrate to the piezoelectric element and unevenness of reliability, in a constitution of the device having the element provided on the substrate and a method for manufacturing the same and to simplify manufacturing steps. SOLUTION: The method for manufacturing the piezoelectric device comprises the steps of forming grooves on the substrate, and casting a molten metal in the connecting part of the piezoelectric element to the substrate through the grooves to connect both the members. Thus, voids generated in a connecting layer are reduced, a connection having a high close contact strength is realized, and characteristics of the connected piezoelectric device are improved.
申请公布号 JP2003008094(A) 申请公布日期 2003.01.10
申请号 JP20010184693 申请日期 2001.06.19
申请人 SEIKO INSTRUMENTS INC 发明人 WAKABAYASHI MARI;ARAOGI MASATAKA
分类号 H01L41/09;H01L41/187;H01L41/22;H01L41/313;H02N2/00;H03H3/08;H03H9/25 主分类号 H01L41/09
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