| 摘要 |
PROBLEM TO BE SOLVED: To precisely mount a semiconductor device having an imaging element. SOLUTION: An imaging element 4 is mounted on a front side of a package 2 composing a semiconductor device 1. Three projections 3 are provided on a backside of the package 2. The three projections 3 are positioned not on a line. The heights of the projections are higher than a flatness of the backside of the package 2, thereby determining one contact surface of the three projections 3. Hence, the posture of the semiconductor device 1 is determined.
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