| 摘要 |
PROBLEM TO BE SOLVED: To secure a junction reliability of soldered electrical parts. SOLUTION: The opening width of a resin opening 15A of a circuit board 10 in its mounting surface side is set to be large than the width of a root 14a of an electrical part 13, an a lower side 14c of the root 14a is brought into contact with an upper surface of a bus bar 11. Under this condition, soldering is carried out from the resin opening 15B on the rear side of the mounting surface. Even when a high temperature of melted solder is transmitted to the circuit board 10, the electrical part 13 does not contact the resin 12 of the circuit board 10, thus generating no stress such as to forcibly separate the soldered junction.
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