| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow temperature regulator in which the reflow temperature of each electronic component is regulated to a recommended value when reflow soldering is performed using an infrared reflow system. SOLUTION: The reflow temperature regulator for regulating the reflow temperature of a specified electronic component when reflow soldering is performed using an infrared reflow system is formed of a material having a good thermal conductivity and regulates the electronic component to increase the reflow temperature by bringing it close to a heat source in the infrared reflow system while keeping a specified distance. |
