METHOD OF MANUFACTURING CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To overcome such a problem that the warpage of an insulating resin sheet in a manufacturing process is remarkable in a semiconductor device where a flexible sheet having a conductive pattern is adopted as a support substrate, a semiconductor element is mounted on the substrate and a whole part is molded. SOLUTION: The resin insulating sheet where a first conductive film 3 and a second conductive film are laminated by an insulating resin 2 is used and a first conductive wiring layer 5 is formed by the first conductive film 3. The semiconductor element 7 is fixed onto overcoat resin 8 covering the first conductive wiring layer 5. Thus, the first conductive wiring layer 5 can freely be routed below the semiconductor element 7 with a fine pattern. The second conductive film formed thick is sealed by a sealing resin layer 13 and it is removed. An outer electrode 14 is formed in the through hole of insulating resin 2.