| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem of a prior art LED lamp that the production process is different for each shape and the process is complicated to lower the productivity and the cost of LED lamp is increased because an enormous investment is required in the equipment. SOLUTION: An LED chip is die bonded in flip-chip shape by ultrasonic welding onto a ceramic substrate on which a wiring pattern and bumps are formed to produce an LED substrate assembly which is then connected electrically and mechanically with an existing supporting member by an appropriate means thus producing an LED lamp. Since the process can be shared among substantially all LEDs of various shapes, productivity is enhanced and the cost can be reduced by reducing investment in the equipment. |
