发明名称 |
SEMICONDUCTOR SUBSTRATE AND FIELD EFFECT TRANSISTOR, AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To form a SiGe layer which has through dislocation density and low surface roughness on an SOI structure as to a semiconductor device and a field effect transistor, and a manufacturing method for them. SOLUTION: An SOI substrate 1 equipped with an insulating layer 1b on an Si substrate 1a and an Si layer 1c on the insulating layer is equipped with SiGe layers 2 and 3 on the Si layer of the SOI substrate, and the SiGe layer partially has a slanting composition area 2 whose Ge composition ratio is gradually increased toward the surface.
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申请公布号 |
JP2003008022(A) |
申请公布日期 |
2003.01.10 |
申请号 |
JP20010186768 |
申请日期 |
2001.06.20 |
申请人 |
MITSUBISHI MATERIALS SILICON CORP;MITSUBISHI MATERIALS CORP |
发明人 |
MIZUSHIMA KAZUKI |
分类号 |
H01L21/205;H01L21/20;H01L27/12;H01L29/786;(IPC1-7):H01L29/786 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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