| 摘要 |
The present invention provides a small image pickup module in which a structure, which mounts a lens-barrel body so as to enclose therein a semiconductor device chip for image pickup mounted on a substrate, is improved, and in which assembly work is easy and a reduction in costs is possible. In accordance with one aspect of the present invention, there is provided a small image pickup module comprising a substrate made from a nonmetal including a ceramic or the like, a semiconductor device chip for image pickup including a two-dimensional C-MOS image sensor or the like which is mounted to the substrate, a lens-barrel body which is attached as a reference on the substrate so as to enclose the semiconductor device chip for image pickup therein, and in which a diaphragm section and a lens fixing portion are press-formed integrally in that order from the distal end portion, and a lens which is mounted to the lens fixing portion of the lens-barrel body. |
