BALL GRID ARRAY SEMICONDUCTOR PACKAGE USING FLEXIBLE CIRCUIT BOARD

摘要

PURPOSE: A BGA(Ball Grid Array) semiconductor package using a flexible circuit board is provided to be capable of preventing the adhesive coated at the flexible circuit board from contaminating a bond finger. CONSTITUTION: A BGA semiconductor package using a flexible circuit board is provided with a semiconductor chip(10), a flexible circuit board(40) for loading the semiconductor chip, an adhesive for attaching the semiconductor chip to the flexible circuit board, and a bond finger(43). The BGA semiconductor package further includes an adhesive overflow barrier dam(30) between the bond finger and the semiconductor chip. At this time, the thickness of the adhesive overflow barrier dam is smaller than that of the semiconductor chip, so that the adhesive overflow barrier dam doesn't be contacted with a conductive wire(50). Preferably, the adhesive overflow barrier dam is non-conductive.