| 摘要 |
PURPOSE: A CMP(Chemical Mechanical Polishing) apparatus having an adiabatic material is provided to prevent the transmission of heat generated from a driving motor portion by forming the adiabatic material on the driving motor portion. CONSTITUTION: A CMP apparatus(100) includes a flat table(110) and a carrier(120). A polishing pad(113) is adhered on an upper surface of the flat table(110). A vacuum absorbing hole(123) is formed on the carrier(120). A slurry supply portion(160) supplies an abrasive. A driving motor portion(130) is connected with the carrier(120) in order to rotate the carrier(120). A piston portion(150) is installed at an upper portion of the driving motor portion(130) in order to load or unload a wafer(1) on the polishing pad(113). A pump portion(140) has a pump(141), a pass-way block(146), a regulator(143), a solenoid valve(145), a transducer(144), and a UPA board(146). The pump portion(140) is located on an adiabatic material(180).
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