发明名称 METHOD FOR FORMING TANTALUM OXIDE USING OZONE-PLASMA TREATMENT
摘要 PURPOSE: A method for forming tantalum oxide using ozone-plasma treatment is provided to prevent a leakage current caused by a deficiency of oxygen or defects remaining in a layer. CONSTITUTION: (Ta(OC2H5)5) as tantalum source is deposited on a substrate in a deposition chamber(21-22). N2 gas is supplied to purge a remaining tantalum source and a byproduct(23). Tantalum oxide layer is deposited by exiting O3 plasma in the chamber, removing carbon in the tantalum oxide layer and prevent a deficiency of oxygen(24). Purge gas(N2) is supplied to remove the O3 plasma and the byproduct(25).
申请公布号 KR20030003320(A) 申请公布日期 2003.01.10
申请号 KR20010038641 申请日期 2001.06.30
申请人 HYNIX SEMICONDUCTOR INC. 发明人 KIM, GYEONG MIN;SONG, HAN SANG
分类号 H01L21/20;(IPC1-7):H01L21/20 主分类号 H01L21/20
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