发明名称 |
METHOD FOR FORMING TANTALUM OXIDE USING OZONE-PLASMA TREATMENT |
摘要 |
PURPOSE: A method for forming tantalum oxide using ozone-plasma treatment is provided to prevent a leakage current caused by a deficiency of oxygen or defects remaining in a layer. CONSTITUTION: (Ta(OC2H5)5) as tantalum source is deposited on a substrate in a deposition chamber(21-22). N2 gas is supplied to purge a remaining tantalum source and a byproduct(23). Tantalum oxide layer is deposited by exiting O3 plasma in the chamber, removing carbon in the tantalum oxide layer and prevent a deficiency of oxygen(24). Purge gas(N2) is supplied to remove the O3 plasma and the byproduct(25).
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申请公布号 |
KR20030003320(A) |
申请公布日期 |
2003.01.10 |
申请号 |
KR20010038641 |
申请日期 |
2001.06.30 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
KIM, GYEONG MIN;SONG, HAN SANG |
分类号 |
H01L21/20;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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主权项 |
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地址 |
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