| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which independent microlenses in respective light receiving parts or respective light emitting parts can be manufactured in a fine shape, simply and easily, and to provide a method of manufacturing the semiconductor device. SOLUTION: The semiconductor device is provided with the light receiving parts 2. The semiconductor device comprises protrusions 5 in upper parts of the parts 2, and the convex microlenses 9 corresponding to the protrusions 5. In the method of manufacturing the semiconductor device, a first film 40 is formed on the whole face of a semiconductor substrate 1 on which the parts 2 are formed, the first film 40 is left only in the upper parts of the protrusions 5 so as to form the protrusions 5, a second film is laminated on the whole face of the semiconductor substrate 1 on the protrusions 5, and the convex microlenses 9 corresponding to the protrusions 5 are formed. |
