| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of a small SMD component. SOLUTION: An element member 1 is mounted on the upper surface of a base 2 having through holes 2a and 2b for electrically connecting terminals 3 and 4 provided, respectively, on the upper and lower surfaces thereof, electrodes of the element member 1 are connected with the terminals 3 and 4 provided on the base 2, and the element member 1 is sealed with a resin sealing body 7. In such a structure of SMD component, a part of the through holes 2a and 2b is choked with cover members 5a and 5b formed of a resist material by photoetching. |
