发明名称 LIGHT EMITTING DIODE
摘要 PROBLEM TO BE SOLVED: To obtain a light emitting diode in which the mounting density can be increased furthermore, filling of black weather-resistant resin can be facilitated and failure rate of product can be lowered. SOLUTION: The LED 1 has a concave reflector 3c at the forward end of a lead 3a, and mounts a light emitting element 2 on the bottom face wherein the lead 3a is branched into dummy leads 3d which are sealed with transparent epoxy resin 5. Since three leads 3a, 3b and 3d lead out from the transparent epoxy resin 5 are bent to support the LED 1 vertically, even a vertical draw-out structure can be surface mounted by reflow furnace. Since adjacent LEDs can be mounted tightly with no interval even in case of a display, mounting density can be enhanced to the extreme. Furthermore, a difference required for controlling the liquid level of black weather-resistant resin can be provided easily between the height H2 at the lower end of a convex lens 6 and the height H1 at the lower end of the transparent epoxy resin 5.
申请公布号 JP2003008070(A) 申请公布日期 2003.01.10
申请号 JP20010189300 申请日期 2001.06.22
申请人 TOYODA GOSEI CO LTD;SANKEN ELECTRIC CO LTD 发明人 SUEHIRO YOSHINOBU;YASUKAWA TAKEMASA;NAKANO HIDEYUKI;HONDA SATOSHI;SHIRAISHI AKIRA
分类号 H01L33/56;H01L33/58;H01L33/62 主分类号 H01L33/56
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