CHIP COMPOSITE ELECTRONIC PART AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a chip composite electronic part where a passive element can be surely measured and a self-alignment effect can be attained in a manufacturing process. SOLUTION: Cutouts are provided to the sides of an insulating board 11, surface electrode terminals 12a and 16a are provided to the cutouts provided on the surface of the board 1, side electrode terminals 12b and 16b are provided on the cutouts provided on the side of the board 1, and back electrode terminals 12c and 16c are provided on the cutouts provided at the rear of the board 1. The back electrode terminals 12c and 16c are made larger in width than the side electrode terminals 12b and 16b but smaller than the surface electrode terminals 12a and 16a. A plurality of passive elements connected to the surface electrode terminals 12a and 16a and a protective film 15 covering the passive elements are provided.