发明名称 OPTICAL SEMICONDUCTOR ELEMENT HOUSING PACKAGE
摘要 <p>PROBLEM TO BE SOLVED: To solve a problem about the fact that heat released from an optical semiconductor element in operation cannot be efficiently exhausted and damages the optical semiconductor element. SOLUTION: An optical semiconductor element housing package is composed of a base 1, a frame 2 mounted on the base 1, and a lid 3 placed on the top of the frame 2. The base 1 is formed of a sintered porous substance which is made of molybdenum powder 50 to 100μm in average grain diameter, contains no particles 25μm or below in grain diameter, and is impregnated with copper. The base 1 is composed of 75 to 95 wt.% sintered porous substance of molybdenum and 5 to 25 wt.% copper.</p>
申请公布号 JP2003008132(A) 申请公布日期 2003.01.10
申请号 JP20010193763 申请日期 2001.06.26
申请人 KYOCERA CORP 发明人 MATSUDA SHIN
分类号 H01L23/02;H01L23/04;H01L23/06;H01S5/024;(IPC1-7):H01S5/024 主分类号 H01L23/02
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