| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electrostatic chuck device which immediately is not unserviceable even if flat plate electrodes are exposed due to abrasion of an insulator, by suppressing occurrence of a discharge between the flat plate electrodes. SOLUTION: The electrostatic chuck device 101 comprises an electrostatic chuck stage 102 winch sucks a semiconductor wafer 11 and a power supply 7 for the electrostatic chuck and it is an integrated assembly sintered with a high permittivity insulation 14, keeping a pair of the flat plate electrodes 103, 104 which have almost semicircular shapes separated by a distance L1, and plane shapes of the flat plate electrodes 103, 104 have shapes with notches 105, 106 under a region of an adsorption surface which is extruded from the semiconductor wafer 11 and, the corner portions of notches 105, 106 have round shapes as well.</p> |
