| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor package in which the lead wire of a thermoelectric cooling element can be surely connected to a metal piece that is brazed to the metalized wiring layer of an input/output terminal, and the heat produced form an optical semiconductor element can be efficiently radiated to the outside. SOLUTION: A notch part 18 is formed as to penetrate the upper and lower surface of the inside of a frame body 2 in a flat plate part 7a of an input/output terminal 7, and a step part whose opening is made small in size viewed from the upper surface side is formed in the notch part 18 on the lower side of the opening on the upper surface side. A metalized layer 13 connected with a metalized wiring layer 12 is formed on the bottom surface of the step of the notch 18, and a metal piece 6 is fitted to the notch 18 and is brazed to the metalized layer 13. A notch 19 whose cross-sectional shape is smaller than the notch 18 is formed in the metal piece 6 at nearly same position as the notch 18 on lower side.
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